Fan-out wafer-level packaging

en

WikiRank.net
ver. 1.6.2

Fan-out wafer-level packaging

Quality:

Fan-out wafer-level packaging - integrated circuit packaging technology. Article “Fan-out wafer-level packaging” in English Wikipedia has 27.5 points for quality (as of July 1, 2025). The article contains 10 references and 3 sections.

In this language version of Wikipedia the article has the best quality. Also, this article is the most popular in that (English) language version.

Since the creation of article “Fan-out wafer-level packaging”, its content was written by 10 registered users of English Wikipedia and edited by 17 registered Wikipedia users in all languages.

The article is cited 15 times in English Wikipedia and cited 23 times in all languages.

The highest Authors Interest rank from 2001:

  • Local (English): #310483 in March 2024
  • Global: #299369 in February 2023

The highest popularity rank from 2008:

  • Local (English): #419881 in September 2023
  • Global: #671507 in June 2024

There are 4 language versions for this article in the WikiRank database (of the considered 55 Wikipedia language editions).

The quality and popularity assessment was based on Wikipédia dumps from July 1, 2025 (including revision history and pageviews for previous years).

The table below shows the language versions of the article with the highest quality.

Languages with the highest quality

#LanguageQuality gradeQuality score
1English (en)
Fan-out wafer-level packaging
27.5101
2Persian (fa)
بسته‌بندی سطح‌ویفر با گنجایش‌خروجی
24.7624
3Chinese (zh)
扇出晶圆级封装
24.6359
4Catalan (ca)
Encapsulat FOWL
18.8069
More...

The following table shows the most popular language versions of the article.

Most popular in all the time

The most popular language versions of the article "Fan-out wafer-level packaging" in all the time
#LanguagePopularity awardRelative popularity
1English (en)
Fan-out wafer-level packaging
81 524
2Chinese (zh)
扇出晶圆级封装
12 663
3Catalan (ca)
Encapsulat FOWL
94
4Persian (fa)
بسته‌بندی سطح‌ویفر با گنجایش‌خروجی
55
More...

The following table shows the language versions of the article with the highest popularity in the last month.

Most popular in June 2025

The most popular language versions of the article "Fan-out wafer-level packaging" in June 2025
#LanguagePopularity awardRelative popularity
1English (en)
Fan-out wafer-level packaging
1 320
2Chinese (zh)
扇出晶圆级封装
637
3Persian (fa)
بسته‌بندی سطح‌ویفر با گنجایش‌خروجی
6
4Catalan (ca)
Encapsulat FOWL
3
More...

The following table shows the language versions of the article with the highest Authors’ Interest.

The highest AI

Language versions of the article "Fan-out wafer-level packaging" with the highest Authors Interest (number of authors). Only registered Wikipedia users were taken into account.
#LanguageAI awardRelative AI
1English (en)
Fan-out wafer-level packaging
10
2Chinese (zh)
扇出晶圆级封装
4
3Catalan (ca)
Encapsulat FOWL
2
4Persian (fa)
بسته‌بندی سطح‌ویفر با گنجایش‌خروجی
1
More...

The following table shows the language versions of the article with the highest Authors’ Interest in the last month.

The highest AI in June 2025

Language versions of the article "Fan-out wafer-level packaging" with the highest AI in June 2025
#LanguageAI awardRelative AI
1Catalan (ca)
Encapsulat FOWL
0
2English (en)
Fan-out wafer-level packaging
0
3Persian (fa)
بسته‌بندی سطح‌ویفر با گنجایش‌خروجی
0
4Chinese (zh)
扇出晶圆级封装
0
More...

The following table shows the language versions of the article with the highest number of citations.

The highest CI

Language versions of the article "Fan-out wafer-level packaging" with the highest Citation Index (CI)
#LanguageCI awardRelative CI
1English (en)
Fan-out wafer-level packaging
15
2Chinese (zh)
扇出晶圆级封装
7
3Persian (fa)
بسته‌بندی سطح‌ویفر با گنجایش‌خروجی
1
4Catalan (ca)
Encapsulat FOWL
0
More...

Scores

Estimated value for Wikipedia:
English:
Global:
Popularity in June 2025:
English:
Global:
Popularity in all years:
English:
Global:
Authors in June 2025:
English:
Global:
Registered authors in all years:
English:
Global:
Citations:
English:
Global:

Quality measures

Interwikis

#LanguageValue
caCatalan
Encapsulat FOWL
enEnglish
Fan-out wafer-level packaging
faPersian
بسته‌بندی سطح‌ویفر با گنجایش‌خروجی
zhChinese
扇出晶圆级封装

Popularity rank trends

Best Rank English:
#419881
09.2023
Global:
#671507
06.2024

AI rank trends

Best Rank English:
#310483
03.2024
Global:
#299369
02.2023

Languages comparison

Important global interconnections (July 2024 – June 2025)

Wikipedia readers most often find their way to information on Fan-out wafer-level packaging from Wikipedia articles about Wafer-level packaging, Advanced packaging, ASE Group, Integrated circuit packaging type and Fan-out. Whereas reading the article about Fan-out wafer-level packaging people most often go to Wikipedia articles on Wafer-level packaging, Integrated circuit packaging type, Fan-out, Integrated circuit packaging and Advanced packaging.

Cumulative results of quality and popularity of the Wikipedia article

List of Wikipedia articles in different languages (starting with the most popular):

News from 28 February 2026

On 28 February 2026 in multilingual Wikipedia, Internet users most often read articles on the following topics: Ali Khamenei, Iran, Ruhollah Khomeini, Jeffrey Epstein, Supreme Leader of Iran, Mohammad Reza I of Iran, 2026 Israeli–United States strikes on Iran, Neil Sedaka, Masoud Pezeshkian, Resident Evil Requiem.

In English Wikipedia the most popular articles on that day were: Ali Khamenei, 2026 Israeli–United States strikes on Iran, Neil Sedaka, Iran, Ruhollah Khomeini, Iran–Israel conflict, Supreme Leader of Iran, Scream 7, Elimination Chamber (2026), World War III.

About WikiRank

The WikiRank project is intended for automatic relative evaluation of the articles in the various language versions of Wikipedia. At the moment the service allows to compare over 44 million Wikipedia articles in 55 languages. Quality scores of articles are based on Wikipedia dumps from July, 2025. When calculating current popularity and AI of articles data from June 2025 was taken into account. For historical values of popularity and AI WikiRank used data from 2001 to 2025... More information